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| Package information - SOT23 Surface mounted, 3 pin package Package outline E e b 3 leads e1 L1 E1 D A A1 L c Dim. A A1 b c D e Millimeters Min. 0.01 0.30 0.085 2.80 Max. 1.12 0.10 0.50 0.20 3.04 - Inches Min. 0.0004 0.012 0.003 0.110 Max. 0.044 0.004 0.020 0.008 0.120 Dim. e1 E E1 L L1 - Millimeters Min. 2.10 1.20 0.25 0.45 Max. 2.64 1.40 0.60 0.62 1.90 NOM Inches Min. 0.083 0.047 0.0098 0.018 Max. 0.104 0.055 0.0236 0.024 0.075 NOM 0.95 NOM 0.037 NOM Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Soldering footprint 0.95 0.037 2.0 0.079 0.9 0.035 0.8 0.031 mm inches Issue 4 - May 2007 (c) Zetex Semiconductors plc 2007 1 www.zetex.com Package information - SOT23 Nominal weight Nominal weight per device 8mg. Tape and reel information Orientation Tape width (mm) 8 8 Reel size (inches) 7 13 No. of components 3,000 10,000 Tape option indicator TA TC Embossed carrier tape configuration P0 K t Top cover tape 10 pitches culmulative tolerance on tape 0.2mm (0.008") D P2 E See Note 1 A0 See Note 1 F W B1 K0 See Note 1 B0 P Embossment Center lines of cavity D1 User direction of feed Dimensions mm (inches) A0, B0, K0 B1 (max.) D D1 (max.) E F P Tape size (mm) 8 See note * 12 See note * 16 See note * 24 See note* 20.10 (0.791) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 0.10 11.50 0.10 (0.453 0.004) 4.00 0.10 (0.157 0.004) to 20.00 0.10 (0.787 0.004) in 4.00 (0.157) increments 4.00 0.10 2.00 0.05 0.40 24.30 (0.957) 4.55 (0.179) 1.50 + 0.10 - 0.00 1.00 (0.039) 1.75 0.10 3.50 0.10 (0.138 0.004) 4.00 0.10 (0.157 0.004) 8.20 (0.323) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 0.10 5.50 0.05 (0.217 0.002) 4.00 0.10 (0.157 0.004) 8.00 0.10 (0.315 0.004) 12.10 (0.476) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 0.10 7.50 0.10 (0.295 0.004) 4.00 0.10 (0.157 0.004) 8.00 0.10 (0.315 0.004) 12.00 0.10 (0.472 0.004) 4.00 0.10 2.00 0.05 0.40 16.30 (0.642) P0 P2 t (max.) W 4.00 0.10 2.00 0.05 0.40 8.00 (0.315) 4.00 0.10 2.00 0.05 0.40 12.00 0.30 (0.472 0.012) NOTES: * A0, B0 and K0 dimensions are determined with respect to EIA/JEDEC rotational and lateral movement requirements (see fig. 1). Issue 4 - May 2007 (c) Zetex Semiconductors plc 2007 2 www.zetex.com Package information - SOT23 0.5mm maximum 20 maximum Component cavity center line 0.5mm maximum 20 maximum B0 Component center line A0 Sketch A (top view) Component lateral movement Sketch B (side or front sectional view) Component rotation - side view Sketch C (top view) Component rotation - top view Figure 1 - rotational and lateral movement Reel configuration Tape slot in core for tape start. 2.5mm min. width, 10mm min. depth T B A D N C Full radius G Tape option TA TC A max. 179 (7.047) 330 (12.992) B min. 1.5 (0.06) G C 13.00 - 13.02 (0.512 - 0.52) D min. 25.0 (0.984) 20.2 (0.795) T max. N min. 50 (1.969) Tape size 8mm 12mm 16mm 24mm 8.4 -9.9 (0.33 - 0.39) 12.4 -16.4 (0.49 - 0.569) 16.4 -18.4 (0.65 - 0.729 ) 24.4 - 26.4 (0.96 - 1.039) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) 30.4 (1.197) This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned. The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. Issue 4 - May 2007 (c) Zetex Semiconductors plc 2007 3 www.zetex.com |
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